- 2 years warranty
- Made in Europe (easy to export)
- Smallest SWIR line-scan camera
- Superb low dark current imaging
- Full flexibility in integration time settings
- Standard CameraLink or GigE Vision interface
- Compliant with National Instruments and Euresys framegrabbers
- Ultra-high resolution and high sensitivity for low-light conditions
- IR camera software (Xeneth) included
- External trigger for signal synchronization
- High line rate imaging at more than 10000 lines per second
World's highest resolution SWIR line-scan camera with excellent sensitivity.
The unique high line resolution achieved by the Lynx-2048 will maximize your production yields. This SWIR solution is perfectly suited for spectroscopy, and for non-destructive and detail-rich imaging from deeper layers of semiconductor materials or measuring the thickness and uniformity of its functional layers.
The Lynx-2048-CL and Lynx-2048-GigE offer in many ways an affordable solution. The small form factor and smallest pixel pitch of 12.5 µm allows more precision and optimization of compact systems with lower cost lenses. The high line resolution subsitutes for costly multiple-camera solutions.
The Lynx-2048-CL is perfectly suited for high speed scanning with high line rates up to 10 kHz. In addition the camera comes with an industry standard CameraLink interface for data transfer at full line rate.
The Lynx-2048-GigE is also a flexible solution with an industry standard GigE Vision and Power over Ethernet interface. You can also synchronize external events by the trigger input.
You will reach optimal image quality with low dark current and excellent signal to noise ratios. Furthermore you can operate multiple integration times.
|Camera Model||Lynx 2048-CL||Lynx 2048-GigE|
|Resolution||2048 x 1||2048 x 1|
|Pixel size||Square pixels: 12.5 μm x 12.5 μm, Rectangular pixels: 12.5 μm x 250 μm||Square pixels: 12.5 μm x 12.5 μm, Rectangular pixels: 12.5 μm x 250 μm|
|Spectral band||0.9 μm to 1.7 μm||0.9 μm to 1.7 μm|
|Peak Quantum Efficiency (QE)||≈ 80 % @ 1.6 μm||≈ 80 % @ 1.6 μm|
|Array length||25.6 mm||25.6 mm|
|Dark current||Square pixels: 1.5 x 10⁶ e-/s, Rectangular pixels: 1.5 x 10⁷ e-/s||Square pixels: 1.5 x 10⁶ e-/s, Rectangular pixels: 1.5 x 10⁷ e-/s|
|Maximum line rate||10 kHz||10 kHz|
|Pixel rate||50 MPixels/sec||25 MPixels/sec|
|Exposure time range||Full flexibility in settings from 3 μs to several seconds||Full flexibility in settings from 3 μs to several seconds|
|CDS||Correlated Double Sampling||Correlated Double Sampling|
|Gain settings||Various settings from 30 fF (HS) till 830 fF (HDR)||Various settings from 30 fF (HS) till 830 fF (HDR)|
|Pixel well depth||from 450 Ke- (HS) till 32 Me- (HDR)||from 450 Ke- (HS) till 10 Me- (HDR)|
|Gain||From 8 e-/ADU count (HS) till 225 e-/ADU count (HDR)||From 8 e-/ADU count (HS) till 225 e-/ADU count (HDR)|
|Dynamic range||From 280:1 (HS) till 2600:1 (HDR)||From 280:1 (HS) till 2600:1 (HDR)|
|ADC||14 bit||14 bit|
|Optical interface||C-mount (optional filter retaining ring), F-mount (Optional)||C-mount (optional filter retaining ring), F-mount (Optional)|
|Camera control||CameraLink, Xeneth API/SDK||GigE Vision, Xeneth API/SDK|
|Image acquisition||Integrate While Read (IWR)/ Integrate Then Read (ITR); Snapshot acquisition||Integrate While Read (IWR) / Integrate Then Read (ITR); Snapshot acquisition|
|Trigger||Trigger in and out; LVCMOS||Trigger in and/or out; LVCMOS|
|Operating mode||Stand-alone or PC-controlled||Stand-alone or PC-controlled|
|Power consumption||+/- 2.6 W||+/- 4.6 W|
|Power supply||12 V||12 V|
|Ambient operating temperature||-40ºC to 70ºC (industrial components)||-40ºC to 70ºC (industrial components)|
|Storage temperature range||-50ºC to 85ºC (industrial components)||-50ºC to 85ºC (industrial components)|
|Dimensions (W x H x L mmᵌ)||49 x 49 x 53||49 x 49 x 71|
|Weight camera head||< 153 g||< 208 g|