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Home Products Shortwave Infrared Swir XSW 640

Features

  • High resolution

  • Easy connectivity

  • Small 20 μm pixel pitch

Designed for use in

  • UAV / UGV

  • Gimbal

  • Night vision

  • Thermal sights

  • Border security

  • Fire fighting

  • Driver assistance

  • Police surveillance

  • Search & Rescue (SAR)

  • Electro optical payloads

Documents

PDF icon XSW-640 Brochure.pdf
PDF icon Xeneth Software V2.6 Brochure

Press Releases

Xenics at SPIE DSS 2011: High performance infrared OEM modules for easy integration
Xenics sees strong growth ahead for OEM Module business
Infrared cameras for security applications

Links

Xenics XSW 640 Series Product Page

Request A Quote

XSW-640 OEM module

Xenics’ XSW-640 OEM module is extremely compact and versatile for easy and swift integration in your SWIR imaging configuration.

Typical OEM applications include infrared imaging for man–portable and unmanned (airborne and land-based) vehicle payloads, night vision, border security, Search & Rescue (SAR) and more.

The XSW-640 OEM module detects short wave infrared radiation between 0.9 (optionally 0.4) and 1.7 μm with a wide dynamic range and wide operating temperature.

The Thermo Electric (TE) stabilization reduces the dark current and noise levels. Together with on-board image processing you will have best contrast and high image quality.

Camera ModelXSW-640-SamtecXSW-640-CLXSW-640 GigE
Detector typeInGaAs Focal Plane Arra (FPA) ROIC with CTIA topologyInGaAs Focal Plane Arra (FPA) ROIC with CTIA topologyInGaAs Focal Plane Arra (FPA) ROIC with CTIA topology
Spectral range 0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm) 0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm) 0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm)
Image format640 (w) x 512 (h) pixels640 (w) x 512 (h) pixels640 (w) x 512 (h) pixels
Pixel pitch20 μm 20 μm 20 μm
Readout modeIntegrate Then Read (ITR), Integrate While Read (IWR)Integrate Then Read (ITR), Integrate While Read (IWR)Integrate Then Read (ITR), Integrate While Read (IWR)
Quantum efficiency80% @ 1.6 μm (SWIR), 85% @ 0.9 μm (VNIR)80% @ 1.6 μm (SWIR), 85% @ 0.9 μm (VNIR)80% @ 1.6 μm (SWIR), 85% @ 0.9 μm (VNIR)
ROIC noiseHigh gain: 60 e-, Low gain: 400 e-High gain: 60 e-, Low gain: 400 e-High gain: 60 e-, Low gain: 400 e-
SensitivityHigh gain: 20 μV/e-; Low gain: 1.6 μV/e-High gain: 20 μV/e-; Low gain: 1.6 μV/e-High gain: 20 μV/e-; Low gain: 1.6 μV/e-
Dark current0.8 x 10⁶e-/s0.8 x 10⁶e-/s0.8 x 10⁶e-/s
Integration capacitorHigh gain: 6.7 fF, Low gain: 85 fFHigh gain: 6.7 fF, Low gain: 85 fFHigh gain: 6.7 fF, Low gain: 85 fF
Array coolingTE1-stabilizedTE1-stabilizedTE1-stabilized
Pixel operability> 99%> 99%> 99%
Focal lengthBroad selection of lenses availableBroad selection of lenses availableBroad selection of lenses available
Optical interface Fixation holes for multiple lens mounts Fixation holes for multiple lens mounts Fixation holes for multiple lens mounts
Maximum frame rate (full frame)100 Hz100 Hz100 Hz
Min region sizeMinimum size 32 x 4Minimum size 32 x 4Minimum size 32 x 4
Integration time range1 μs - 40 ms 1 μs - 40 ms 1 μs - 40 ms
Noise levelHigh gain: 120 e-, Low gain: 400 e-High gain: 120 e-, Low gain: 400 e-High gain: 120 e-, Low gain: 400 e-
Gain levelHigh gain: 1.28 e-/ADU, Low gain: 16.2 e-/ADUHigh gain: 1.28 e-/ADU, Low gain: 16.2 e-/ADUHigh gain: 1.28 e-/ADU, Low gain: 16.2 e-/ADU
On-board image processingImage correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equilization, Trigger PossibilitiesImage correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equilization, Trigger PossibilitiesUp to 4 NUCs, Auto-Gain, Trigger Possibilities
Analog-to-Digital (ADC)14 bits14 bits14 bits
Digital output formatBT.601-6/BT .656-5CameraLink or Xeneth API/SDKGigE Vision or Xeneth API/SDK
Module controlSerial LVCMOS 3 V (XSP)CameraLinkGigE Vision
TriggerTrigger in or out (configurable)Trigger in or out (configurable)Trigger in or out (configurable)
Power consumption+/- 2.6 W2.8 W4 W
Power supplyDV 12 VDV 12 VDV 12 V
Shock40 g, 11 ms according to MIL-STD810G/MIL-STD883J40 g, 11 ms according to MIL-STD810G/MIL-STD883J40 g, 11 ms according to MIL-STD810G/MIL-STD883J
Vibration5 g (20 Hz to 2000 Hz) according to MIL-STD810G/MIL-STD883J5 g (20 Hz to 2000 Hz) according to MIL-STD810G/MIL-STD883J5 g (20 Hz to 2000 Hz) according to MIL-STD810G/MIL-STD883J
Operating case temperature-40ºC to 70ºC -40ºC to 70ºC -40ºC to 70ºC
Storage temperature range-40ºC to 85ºC -40ºC to 85ºC -40ºC to 85ºC
Dimensions (width x height x length) - excluding lens45 x 45 x 51 mm45 x 45 x 55 mm45 x 45 x 65 mm
Weight module120 g129 g 165 g