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Xenics MicroCube LWIR compact thermal core

Extreme Compact Design & Ultra Efficient Power Consumption LWIR Thermal Core

The Xenics MicroCube is the latest generation of thermal cores, featuring a 12µm pixel pitch and efficient SWaP design offering a standard video interface to ensure integration into many thermal devices.

Optimized size, weight and power requirements make this thermal core the ideal candidate for applications where consumption and footprint are key factors, such as UAV's, UGV's robot-type platforms, and handheld/battery-powered equipment.

Despite it's diminutive footprint, the MicroCube is able to detect a slight discrepancy up to NETD <40mK.

Xenics Exosens MicroCube 640 Technical Specifications
Camera ModelMicroCube 640
SensorMicrobolometer
Pixel pitch12 µm
Image format640 x 480 pixels
Spectral range8 - 14 µm
Max frame rate60 Hz
Operating temperature range-40°C to +70°C
Power consumption (DF40)< 1.2 W
QualificationIndustrial (Standard grade)
Max NETD (F/1, 300K, 30Hz)<50 mK or <40 mK
Output optionsMIPI-CSI, DF40, UVC
Image processingBPC (Bad Pixel Correction), NUC (Non Uniformity Correction), Shutterless NUC
Image optimizationAGC (Automatic Gain Control)
Dimensions (L x W x H)22.0 x 22.0 x 26.8 mm3
Weight (DF40)<25 g